Transmit-receive means for phased-array active antenna system using rf redundancy 
An improved phased-array active antenna transmit-receive means utilizing a multiplicity of individual transmit-receive cells positioned in an array format upon a common wafer of semiconductor material. Each transmit-receive cell, comprises a multiplicity of redundant, integrated circuit, electronic devices implanted upon the common semiconductor substrate. The transmit-receive cells utilize novel mitered mechanical switches to permanently interconnect individual electronic devices into either transmit or receive circuits during the fabrication and test of the transmit-receive cells. Radio frequency and direct current input and output vias formed from a novel metal evaportion technique connect the devices upon the surface of the common semiconductor wafer to underlying, insulated direct current distribution circuits and a radio frequency manifold. This array of improved phased-array active antenna transmit-receive means comprised of transmit-receive cells sharing common central processing means, logic control and heat dissipation means results in a significant reduction in the size and weight of the standard phased-array active antenna system. This significant reduction in antenna system size and weight is very important in broad band electronic countermeasure systems or narrow band phased array active antenna radar systems as used in advanced tactical fighters, or space applications. 

Lightweight, low profile phased array antenna with electromagnetically coupled integrated subarrays 
A lightweight, low profile phased array antenna 10 is disclosed which includes an electromagnetically coupled integrated subarray in a multilayer structure with no vertical electrical connections and no phase shifters. The integrated subarray includes a first layer 11 having an array of patches 20 of electrically conductive material. A second layer 15, is provided, in parallel registration with the first layer 11, which includes an array of resonators 22, each resonator 22 being electromagnetically coupled to a corresponding patch 20 in the first layer 11. A third layer 19 is provided which is in parallel registration with the second layer 15. Electromagnetic couplers 24 and 34 in the second and third layers 15 and 19 couple energy received by resonators 22 in the second layer 15, to processing circuitry in the third layer 19. The antenna of the present invention is adapted for transmit and receive modes of operation. 

Microwave chip carrier package having cover-mounted antenna element 
A package for a microwave circuit chip and associated microstrip antenna is formed of a multi-layer ceramic laminate within which is supported a microwave chip carrier and on an outer surface of which a microstrip antenna disposed. A first ceramic layer is supported on metallic base member and contains signal lines for interfacing the chip with the external world. Disposed atop the first ceramic layer is a second ceramic layer which forms a protective seal ring around the perimeter of the chip. A third ceramic cover layer is mounted atop the seal ring layer and contains one or more antenna elements on its outer surface. Signal line connections between the chip and the antenna elements are effected through tuned networks that extend from signal leads on the chip to conductors on the first ceramic layer. Signal connections from the first ceramic layer to the antenna on the cover may be formed by conductive vias through the ceramic seal ring layer or conductors along sidewalls of the seal ring layer and cover. Preferably, the first layer and the seal ring layer contain a ground plane vias distributed around the perimeter of the chip, to provide electrical continuity between the metal base member and a ground plane on the interior surface of the cover. 

Assembly of semiconductor chips 
A three dimensional package having at least one semiconductor chip having input/output conductive pads along its periphery includes a dielectric carrier over at least a portion of the chip and a plurality of conductors mounted on the carrier between the chip and the dielectric carrier. The plurality of conductors are mounted within the periphery of the chip with one end connected to the conductive pads and with the other end of the plurality of conductors exiting from the same side of the chip. The plurality of conductors exiting from the same side are electrically coupled to an interconnect substrate. 

Single substrate microwave radar transceiver including flip-chip integrated circuits 
A microwave radar transceiver assembly (30) includes a monolithic microwave integrated circuit (MMIC) chip (58) having a coplanar waveguide transmssion lines (100, 102, 104) formed on the same surface (58a) as the electronic elements thereof. Coplanar waveguide transmission lines (68, 70, 72) are also formed on a surface (62a) of a substrate (62). The transceiver chip (58), in addition to other chips (56, 60), are mounted on the substrate (62) in a flip-chip arrangement, with the respective surfaces (58a, 62a) on which the transmission lines (100, 102, 104; 68, 70, 72) are formed facing each other. Electrically conductive bumps (106, 108, 110) are formed on portions of the transmission lines (100, 102, 104) of the chips (56, 58, 60) which are to be interconneced with the transmission lines (68, 70, 72) of the substrate (62), and solder (114) is formed on the portions of the transmission line (68, 70, 72) of the substrate (62) which are to be interconnected with the transmission lines (100, 102, 104) of the chips (56, 68, 60). The bumps (106, 108, 110) provide spacing between the mating surfaces (58a, 62a) of the substrate (62) and chips (56, 68, 60), and isolation between electronic elements on the chips (56, 58, 60). 

Microwave system employing optically phased conformal antennas having photonic interconnects and method of forming photonic interconnects 
An optically phased conformal antenna and photonic interconnect therefor that may be used in such microwave systems. Rows of microwave circuits are disposed on top of a cooling arrangement disposed on a curved surface. An optical ribbon cable disposed on top of the microwave circuits is employed to couple signals to the microwave circuits. Microwave antennas are disposed on top of the optical ribbon cable which has windows therein that permit welding of the antennas to the appropriate microwave circuits. Optical coupling of signals from the optical cable to the microwave circuits is achieved through the use of diffraction gratings, and the like, formed in the optical cable, in conjunction with laser diodes and detectors disposed on the chips. 

High temperature co-fired ceramic integrated phased array packaging 
A phased array package using a cofired ceramic material system to integrate antenna elements and an hermetic multi-chip MMIC cavity into a single module to provide incorporation of microwave circuit geometries into a system which has been used in the prior art only for low frequency applications. The integration provides a package very similar to a conventional integrated circuit package with substantial cost reductions over the complicated microwave assemblies of the present art. 

Miniature modular microwave end-to-end receiver 
An end-to-end microwave receiver system contained in a single miniature hybrid package mounted on a single heatsink, including an input end connected to a microwave receiver antenna and an output end which produces a digital count proportional to the amplitude of a signal of a selected microwave frequency band received at the antenna and corresponding to one of the water vapor absorption lines near frequencies of 20 GHz or 30 GHz. The hybrid package is on the order of several centimeters in length and a few centimeters in height and width. The package includes an L-shaped carrier having a base surface and a vertical wall extending up from the base surface and forming a corner therewith, external connection pins extending through the vertical wall. Modular blocks rest on the base surface against the vertical wall and support microwave monolithic integrated circuits on top surfaces thereof connected to the external connection pins. The modular blocks lie end-to-end on the base surface so as to be modularly removable by sliding along the base surface beneath the external connection pins away from the vertical wall. 

Layered parallel interface for an active antenna array 
A transmit/receive layer is provided adjacent to an array of antenna elements. The transmit/receive layer has an array of transmit receive modules, each module associated with one of the antenna elements. An analog to digital converter and a digital to optical converter of one of the modules couple an RF signal from the associated antenna element to optical fibers. An optical to RF converter in each of the modules converts an amplitude modulated optical transmit signal from an optical fiber to an RF transmit signal for transmission by the associated antenna element. Frequency down and up converters can be added to perform super heterodyne frequency conversion based on a reference frequency control signal transmitted over the optical fibers. At the ends of the optical fibers opposite to the transmit/receive layer, a receive layer, a transmit layer, transmit and receive beamforming layers, dedicated signal synthesizer, control signals, and amplitude modulated optical diode lasers and photodiodes are provided. The transmit layer provides an array of amplitude modulated laser diodes, each associated with one of the antenna elements. The receive layer provides an array of receive optical to digital converters coupled to the optical fibers. A matrix of switches selects appropriate signals from the M.times.N array of parallel receiving beams for subsequent radar target surveillance, tracking, and identification processing.